The performance of the crystal will be affected. We strongly recommend to avoid such things. It may cause frequency drift. The worse case is that it may cause a short circuit of the customer's circuit.

The running of the crystal, that is, the temperature frequency difference is a feature that affects from a specific angle cutting. Now a common cutting method is "AT" cutting.
AT cuts a 35x15 'to the Z axis in the angle of the Y-axis, and the BT cut is -45x to the Z axis in the Y axis. It is easy to understand. The two cuts are as follows.
Usually the same frequency BT cutting blank part is thicker than AT, so the frequency of BT cutting can reach higher. The main difference between AT cutting and BT cutting is that their temperature frequency is different. The temperature coefficient curve of the method.

 

 

Aging refers to the changes in the crystal frequency over time. The aging is positive and negative. The aging effect exacerbates the overall frequency of the crystal oscillator. The aging is mainly affected by two important factors, that is, pollutants and pressure. Tests prove that pollutants on the surface of the transistor usually cause negative values \\u200b\\u200bof frequency change, but excessive pressure can cause frequency to change the frequency. When the chip is placed in the base, it will be very likely to be squeezed, compressed, or distorted by the external device. This causes pressure on the chip. This pressure is released over time and exacerbates the frequency of the positive value. The assembly is assembled. When the crystal is checked, the appropriate base will be eliminated or reduced unnecessary pressure. For a crystal finished product L, the heat cycle may accelerate the practice and relax the packaging pressure. The pollutants on the chip come from multiple steps to produce. The pollutants attached to the surface of the chip cause the frequency negative value due to a large amount of load effect. Pollutants should be By improving the cleanliness of each step in the production process and chip manufacturing process. Crystals can predict to a certain extent to reduce aging value. Because aging follows the counter number curve, most crystal aging occurs in the first year. In the second year or later, the level of crystal aging will increase.

The tensile value of the crystal is used to measure the value that affects frequency changes through load capacitors. Circuit designers can change the frequency by changing the capacitance of the crystal. When the crystal is in a given load capacitor range, the frequency change is determined by the pull value.